Bộ 27 Khuôn Làm Nóng Trực Tiếp

Giới thiệu Bộ 27 Khuôn Làm Nóng Trực Tiếp

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Features:
These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate.
Can be heated by the hot air machine, these stencils are not easy to deform when heated.
Cooperate with  ordinary air , the manual reballing can be carried out, no need to purchase another reballing platform.
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable.
It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.

Specifications:
Material: 304 stainless steel
Color: as shown
Stencils
Specifications: as the picture
Quantity: 27 PCS/Set
Weight: 60g

Package Included:
27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air . Pay attention to adjusting air temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.

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